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02692cam a2200565 a 4500 |
| 001 |
50905930 |
| 003 |
OCoLC |
| 005 |
20040219152802.0 |
| 007 |
he bmb024bbca |
| 008 |
021031s2001 mdua bb f100 0 eng d |
| 040 |
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|a COMN
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|a C 13.58:6566
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| 090 |
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|a TK7871.85
|b .W67
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| 111 |
2 |
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|a Workshop on Temperature Measurement of Semiconductor Wafers Using Thermocouples
|d (2000 :
|c NIST)
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| 245 |
1 |
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|a Workshop on temperature measurement of semiconductor wafers using thermocouples
|h [microform] /
|c K.G. Kreider ... [et al., editors].
|
| 264 |
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1 |
|a Gaithersburg, MD :
|b U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology,
|c [2001]
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| 300 |
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|a 1 volume (various pagings) :
|b illustrations ;
|c 28 cm.
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| 336 |
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|a text
|b txt
|2 rdacontent.
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| 337 |
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|a microform
|b h
|2 rdamedia.
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| 338 |
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|a microfiche
|b he
|2 rdacarrier.
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| 490 |
1 |
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|a NISTIR ;
|v 6566.
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| 500 |
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|a "January 5, 2001."
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| 500 |
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|a Shipping list no.: 2003-0523-M.
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| 504 |
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|a Includes bibliographical references.
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| 520 |
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|a Presentation materials from the satellite workshop held at NIST, September 19, 2000 in collaboration with the 8th International Conference on Advanced Thermal Processing of Semiconductors-- RTP'2000 outlining how to use thermocouples for measurements of temperature in semiconductor processing and how to achieve the highest accuracy.
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| 533 |
|
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|a Microfiche.
|b [Washington, D.C.] :
|c Supt. of Docs., U.S. G.P.O.,
|d 2002.
|e 2 microfiches : negative..
|7 s2002 dcun b.
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| 650 |
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0 |
|a Thermocouples
|x Industrial applications
|v Congresses.
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| 650 |
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0 |
|a Semiconductor wafers
|x Thermal properties
|x Measurement
|v Congresses.
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| 655 |
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7 |
|a Congresses.
|2 lcgft.
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| 655 |
|
7 |
|a Conference papers and proceedings.
|2 lcgft.
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| 700 |
1 |
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|a Kreider, Kenneth G.
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| 710 |
2 |
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|a National Institute of Standards and Technology (U.S.)
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| 830 |
|
0 |
|a NISTIR ;
|v 6566.
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|a MARCIVE Comp, 2018.05
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|a MARCIVE Comp, 2017.10
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|a MARCIVE August, 2017
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|a MARCIVE extract Aug 5, 2017
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