Power electronic packaging design, assembly process, reliability and modeling /
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly, reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design,...
| Main Author: | Liu, Yong (Micro-optoelectronic mechanical systems professor) |
|---|---|
| Other Authors: | SpringerLink (Online service) |
| Format: | eBook |
| Language: | English |
| Published: |
New York :
Springer,
©2012.
New York : [2012] |
| Physical Description: |
1 online resource (xviii, 591 pages) : illustrations. |
| Subjects: |
CMU Electronic Access
Electronic Resource Click Here| Location | Call Number: | Status |
|---|---|---|
| CMU Electronic Access | Available |