Modeling, analysis, design, and tests for electronics packaging beyond Moore
| Main Author: | Zhang, Hengyun. |
|---|---|
| Other Authors: | Che, Faxing., Lin, Tingyu., Zhao, Wensheng., ScienceDirect (Online service) |
| Format: | Electronic |
| Language: | English |
| Published: |
[Place of publication not identified] :
Woodhead Publishing,
2019.
|
| Physical Description: |
1 online resource. |
| Series: |
Woodhead Publishing series in electronic and optical materials.
|
| Subjects: |
CMU Electronic Access
Electronic Resource Click Here| Location | Call Number: | Status |
|---|---|---|
| CMU Electronic Access | Available |