Advanced packaging and manufacturing technology based on adhesion engineering wafer-level transfer packaging and fabrication techniques using interface energy control method /
This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding b...
| Main Author: | Seok, Seonho, |
|---|---|
| Other Authors: | SpringerLink (Online service) |
| Format: | eBook |
| Language: | English |
| Published: |
Cham :
Springer International Publishing,
[2018]
|
| Physical Description: |
1 online resource (viii, 115 pages) : 106 illustrations. |
| Series: |
Springer series in advanced manufacturing.
|
| Subjects: |
CMU Electronic Access
Electronic Resource Click Here| Location | Call Number: | Status |
|---|---|---|
| CMU Electronic Access | Available |