Robust design of microelectronics assemblies against mechanical shock, temperature and moisture
This book discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. De...
| Main Author: | Wong, E. -H. |
|---|---|
| Other Authors: | Mai, Y. W., 1946-, ScienceDirect (Online service) |
| Format: | eBook |
| Language: | English |
| Published: |
Cambridge, UK :
Woodhead Publishing,
[2015]
|
| Physical Description: |
1 online resource. |
| Series: |
Woodhead Publishing series in electronic and optical materials ;
no. 81. |
| Subjects: |
CMU Electronic Access
Electronic Resource Click Here| Location | Call Number: | Status |
|---|---|---|
| CMU Electronic Access | Available |