Solder joint technology materials, properties, and reliability /

"Critical demands are placed on solder joint technology in flip chip and other high density packaging for advanced electronic consumer products. This book describes the fundamentals of the copper-tin reaction and electromigration that underlie these reliability problems, and the potential for i...

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Bibliographic Details
Main Author: Tu, K. N. (King-Ning), 1937-
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: New York : Springer, ©2007.
New York : [2007]
Series:Springer series in materials science ; 92.
Physical Description:
1 online resource (xvi, 368 pages) : illustrations.
Subjects:
Welded joints.
Welded joints -- Reliability.
Solder and soldering.
Metals -- Weldability.
chemie.
chemistry.
elektronica.
electronics.
instrumentatie.
instrumentation.
fabricage.
manufacture.
metalen.
metals.
optische instrumenten.
optical instruments.
kwaliteitscontroles.
quality controls.
machines.
optica.
optics.
Chemistry (General)
Chemie (algemeen)
Online Access:SpringerLink - Click here for access
Holdings details from CMU Electronic Access C502
Copy 1 CMU Electronic Access Available

Internet

SpringerLink - Click here for access

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