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Solder joint technology materials, properties, and reliability /
"Critical demands are placed on solder joint technology in flip chip and other high density packaging for advanced electronic consumer products. This book describes the fundamentals of the copper-tin reaction and electromigration that underlie these reliability problems, and the potential for i...
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Main Author: | |
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Corporate Author: | |
Format: | eBook |
Language: | English |
Published: |
New York :
Springer,
©2007.
New York : [2007] |
Series: | Springer series in materials science ;
92. |
Physical Description: |
1 online resource (xvi, 368 pages) : illustrations. |
Subjects: | |
Online Access: | SpringerLink - Click here for access |
Copy 1 | CMU Electronic Access | Available |
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