3D interconnect architectures for heterogeneous technologies modeling and optimization /
This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D...
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| Main Author: |
Bamberg, Lennart. |
| Other Authors: |
Joseph, Jan Moritz., García Ortiz, Alberto, 1972-, Pionteck, Thilo., SpringerLink (Online service) |
| Format: |
eBook
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| Language: |
English
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| Published: |
Cham, Switzerland :
Springer,
2022.
|
| Physical Description: |
1 online resource (403 pages)
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| Subjects: |
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