Carbon nanotubes for interconnects process, design and applications /
This book provides a single-source reference on the use of carbon nanotubes (CNTs) as interconnect material for horizontal, on-chip and 3D interconnects. The authors demonstrate the uses of bundles of CNTs, as innovative conducting material to fabricate interconnect through-silicon vias (TSVs), in o...
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| Other Authors: |
To-Sanial, Aida,, Dijon, Jean,, Maffucci, Antonio,, SpringerLink (Online service) |
| Format: |
eBook
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| Language: |
English
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| Published: |
Switzerland :
Springer,
[2016]
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| Physical Description: |
1 online resource (xii, 333 pages) : illustrations (some color)
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| Subjects: |
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