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|a Thermal sensors :
|b principles and applications for semiconductor industries /
|c Chandra Mohan Jha, editor.
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|a New York :
|b Springer,
|c 2015.
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|c ©2015.
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|a 1 online resource :
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|a Online resource; title from PDF title page (Ebsco, viewed April 20, 2015).
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|a Includes bibliographical references.
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|a Introduction -- Fundamentals of Thermal Sensors -- Types of Thermal Sensors -- Sensor Measurement Capability -- Microprocessor Temperature Sensing and Thermal Management -- Microelectronics Thermal Sensing -- Thermal Sensors for Energy Converter Applications.
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|a This book is a comprehensive guide to both the fundamentals of thermal sensors and their advanced functions. Key topics include sensor materials, CMOS-compatible sensors, measurement capabilities, thermal management and manufacturing processes. The introductory chapter covers the basic principles of thermal sensors from the essentials of heat transfer to smart wireless sensors. Later chapters illustrate the wide range of thermal sensor uses, from microprocessor thermal sensing to energy converter applications. Modeling and simulation techniques are used to explain the future direction of the field. Designed for researchers and practitioners working with wireless sensors and thermal management, Thermal Sensors: Principles and Applications for Semiconductor Industries is a valuable reference to the benefits and challenges these sensors offer. Advanced-level students studying mechanical or electrical engineering and networks will also find the content useful.
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|a Thermometers.
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|a Llibres electrònics.
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1 |
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|a Jha, Chan Mohan,
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|6 505-00/(S
|a 2.8.3 Smart Sensors for Wearables -- References -- 3 Sensor Measurement Capability -- 3.1 Introduction -- 3.2 Variability in Measurements -- 3.3 Accuracy -- 3.4 Precision -- 3.5 Repeatability -- 3.6 Reproducibility -- 3.7 Linearity -- 3.8 Stability -- 3.9 Measurement System Capability -- 4 Microprocessor Temperature Sensing and Thermal Management -- 4.1 Junction Temperature and Thermal Sensors -- 4.1.1 Thermal Design Power -- 4.1.2 Measurement of Tj -- 4.1.2.1 CMOS Sensors in Microprocessors -- 4.1.2.2 Diode Sensors -- 4.1.2.3 DiodeDTS Calibration -- 4.1.2.4 Resistance Temperature Detectors (RTDs) -- 4.1.2.5 RTD Calibration -- 4.1.2.6 Single Point Calibration -- 4.1.3 Hot Spot ET Evaluation -- 4.2 Microprocessor Thermal Management -- 4.2.1 Package Thermal Resistance-k Parameter (kxy) -- 4.2.2 Package Thermal Resistance-R Parameter (Rxy) -- 4.2.3 Package Thermal Resistance- Parameter () -- 4.2.4 Thermal Test Vehicle (TTV) Design -- 4.2.5 Uniform Power Source and Rjc Evaluation -- 4.2.5.1 Bond Line Thickness -- 4.2.5.2 Contact Resistances -- 4.2.5.3 Tc Measurement in TTV -- 4.2.5.4 Rjc Measurement in TTV -- 4.2.6 Non-uniform Power Source and Evaluation -- 4.2.6.1 Density Factor (DF) -- 4.2.6.2 Thermal Impact of Non-uniform Power -- 4.3 Sensitivity Analysis and Thermal Impacts -- References -- 5 Microelectronics Thermal Sensing: Future Trends -- 5.1 Multi-chip Packages -- 5.2 3D Packages -- 5.3 Modeling and Simulation Techniques -- 5.3.1 Modeling Methods -- 5.3.2 3D Package Modeling -- 5.4 Conclusions -- References -- 6 Thermal Sensors for Energy Converter Applications -- 6.1 Thermal Management for Micro Energy Converters -- 6.2 Thermal Sensors for Micro Fuel Cells -- 6.3 Ceramic Micro-Heater, Micro-Sensor for M-PEMFC -- 6.3.1 Integrated Micro Heater for PEMFC and SOFC -- 6.3.2 Integrated Micro Temperature Sensor for PEMFC.
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