Properties of copper and copper alloys at cryogenic temperatures
Main Author: | Simon, N. J. |
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Other Authors: | Drexler, E. S., Reed, R. P. 1934-, International Copper Association., National Institute of Standards and Technology (U.S.) |
Format: | Microfilm |
Language: | English |
Published: |
Boulder, CO : Washington, D.C. : [Springfield, VA] :
U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O. ; [Order from National Technical Information Service],
1992.
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Physical Description: |
1 volume (various pagings) : illustrations ; 28 cm. |
Series: |
NIST monograph ;
177. |
Subjects: |
CMU Storage Gov Pub Microfiche
Location | Call Number: | Status |
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CMU Storage Gov Pub Microfiche | C 13.44:177 | Available |