Properties of copper and copper alloys at cryogenic temperatures

Main Author: Simon, N. J.
Other Authors: Drexler, E. S., Reed, R. P. 1934-, International Copper Association., National Institute of Standards and Technology (U.S.)
Format: Microfilm
Language: English
Published: Boulder, CO : Washington, D.C. : [Springfield, VA] : U.S. Dept. of Commerce, Technology Administration, National Institute of Standards and Technology ; For sale by the Supt. of Docs., U.S. G.P.O. ; [Order from National Technical Information Service], 1992.
Physical Description: 1 volume (various pagings) : illustrations ; 28 cm.
Series: NIST monograph ; 177.
Subjects:

CMU Storage Gov Pub Microfiche

LocationCall Number: Status
CMU Storage Gov Pub Microfiche C 13.44:177 Available