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Institution
Collection
Format
Subject
17
Electronic packaging
6
Electronic packaging Materials
5
Nanotechnology
3
Electronic apparatus and appliances Design and construction
3
Nanostructured materials
2
Bioelectronics
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2
Electronics Materials Permeability
2
Nanophotonics
2
Printed circuits Design and construction
2
Sealing (Technology)
2
Solder and soldering
2
Surface mount technology
2
Thermal interface materials
1
Adhesives
1
Adhesives Electric properties
1
Biomedical engineering
1
Chemistry
1
Copper wire
1
Electric connectors
1
Electronic apparatus and appliances Temperature control
1
Electronic packaging Moisture
1
Electronics
1
Electronics Materials
1
Engineering
1
Flip chip technology
1
Heat Transmission
1
Integrated circuits Design and construction
1
Microelectromechanical systems
1
Microelectronics
1
Plastics in packaging Moisture
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Author
11
SpringerLink (Online service)
9
ScienceDirect (Online service)
4
Wong, C. P., 1947-
3
Li, Yi
2
Brindley, Keith
2
DeVoto, Douglas,
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2
Greenhouse, Hal
2
Moon, Kyoung-Sik
2
Morris, James E., 1944-
2
National Renewable Energy Laboratory (U.S.),
1
Abdul Razak, Kamrosni,
1
Baillin, Xavier,
1
Chauhan, Preeti S.,
1
Che Halin, Dewi Suriyani,
1
Choubey, Anupam,
1
Chung, William 1964-
1
Electronic Packaging Interconnect Technology Symposium
1
Electronic Packaging Interconnect Technology Symposium Kuah, Kedah, Malaysia)
1
Fan, X. J.
1
Fletcher, Andrew E.,
1
International Workshop on Nanopackaging
1
International Workshop on Nanopackaging Grenoble, France)
1
Joachim, C.,
1
Kakaç, S.
1
Lai, Yi-Shao,
1
Lee, Ning-Cheng
1
Licari, James J., 1930-
1
Liu, Yong (Micro-optoelectronic mechanical systems professor)
1
Lowry, Robert 1944-
1
Lu, Daniel
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