Nucleation and growth of metals from thin films to nanoparticles /
Nucleation and Growth of Metals: From Thin Films to Nanoparticles explores how nucleation and growth phenomena condition the morphology and related characteristics of metallic thin films and nanoparticles to help control the functional properties of these objects. The book brings a rigorous theoreti...
| Main Author: | Haumesser, Paul-Henri. |
|---|---|
| Other Authors: | ScienceDirect (Online service) |
| Format: | eBook |
| Language: | English |
| Published: |
London, UK : Kidlington, Oxford :
ISTE Press, Ltd. ; Elsevier,
[2016]
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| Physical Description: |
1 online resource. |
| Series: |
RSC nanoscience & nanotechnology.
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| Subjects: |
| Summary: |
Nucleation and Growth of Metals: From Thin Films to Nanoparticles explores how nucleation and growth phenomena condition the morphology and related characteristics of metallic thin films and nanoparticles to help control the functional properties of these objects. The book brings a rigorous theoretical approach to nucleation and growth phenomena, with a particular focus on the essential aspects and outcomes of this theory. The author explores a general framework for the nucleation and growth of condensed phases from liquid solutions. Practical situations are extensively described, providing state-of-the art information on Cu electroplating and related processes for the fabrication of advanced interconnects and elaboration of metallic nanoparticles. |
|---|---|
| Item Description: |
Nucleation and Growth of Metals: From Thin Films to Nanoparticles explores how nucleation and growth phenomena condition the morphology and related characteristics of metallic thin films and nanoparticles to help control the functional properties of these objects. The book brings a rigorous theoretical approach to nucleation and growth phenomena, with a particular focus on the essential aspects and outcomes of this theory. The author explores a general framework for the nucleation and growth of condensed phases from liquid solutions. Practical situations are extensively described, providing state-of-the art information on Cu electroplating and related processes for the fabrication of advanced interconnects and elaboration of metallic nanoparticles. Includes bibliographical references and index. |
| Physical Description: |
1 online resource. |
| Bibliography: |
Includes bibliographical references and index. |
| ISBN: |
0081012039 9780081012031 |