Wafer-level chip-scale packaging analog and power semiconductor applications /
This book presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability, and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The...
| Main Author: | Qu, Shichun, |
|---|---|
| Other Authors: | Liu, Yong,, SpringerLink (Online service) |
| Format: | eBook |
| Language: | English |
| Published: |
New York :
Springer,
[2015]
|
| Physical Description: |
1 online resource. |
| Subjects: |
CMU Electronic Access
Electronic Resource Click Here| Location | Call Number: | Status |
|---|---|---|
| CMU Electronic Access | Available |