Nanopackaging nanotechnologies and electronics packaging /
Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are...
| Other Authors: | Morris, James E., 1944-, SpringerLink (Online service) |
|---|---|
| Format: | eBook |
| Language: | English |
| Published: |
New York :
Springer,
©2008.
New York : [2008] |
| Physical Description: |
1 online resource (xxi, 543 pages) : illustrations. |
| Subjects: |
Table of Contents:
- Nanopackaging: Nanotechnologies and Electronics Packaging
- Modelling Technologies and Applications
- Application of Molecular Dynamics Simulation in Electronic Packaging
- Advances in Delamination Modeling
- Nanoparticle Properties
- Nanoparticle Fabrication
- Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges
- Nanostructured Resistor Materials
- Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging
- Nanoconductive Adhesives
- Nanoparticles in Microvias
- Materials and Technology for Conductive Microstructures
- A Study of Nanoparticles in SnAg-Based Lead-Free Solders
- Nano-Underfills for Fine-Pitch Electronics
- Carbon Nanotubes: Synthesis and Characterization
- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications
- Carbon Nanotubes for Thermal Management of Microsystems
- Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes
- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes
- Nanowires in Electronics Packaging
- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging
- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities
- Nanoelectronics Landscape: Application, Technology, and Economy
- Errata.