Nanopackaging nanotechnologies and electronics packaging /
Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are...
| Other Authors: | Morris, James E., 1944-, SpringerLink (Online service) |
|---|---|
| Format: | eBook |
| Language: | English |
| Published: |
New York :
Springer,
©2008.
New York : [2008] |
| Physical Description: |
1 online resource (xxi, 543 pages) : illustrations. |
| Subjects: |
| LEADER | 07200cam a2200949 a 4500 | ||
|---|---|---|---|
| 001 | 405547106 | ||
| 003 | OCoLC | ||
| 005 | 20240223121953.0 | ||
| 006 | m o d | ||
| 007 | cr cn||||||||| | ||
| 008 | 090622s2008 nyua ob 001 0 eng d | ||
| 019 | |a 316006466 |a 423033759 |a 428882818 |a 500973559 |a 646035636 |a 756712562 |a 781269646 |a 815754533 |a 858881518 |a 985060737 |a 1005766194 |a 1044280827 |a 1056373513 |a 1073060478 |a 1086921279 |a 1100910967 |a 1102280289 |a 1110807164 |a 1112538888 |a 1162775308 |a 1203985117 |a 1204092371 |a 1391799895 | ||
| 020 | |a 9780387473260 | ||
| 020 | |a 0387473262 | ||
| 020 | |a 9780387473253 |q (cloth) | ||
| 020 | |a 0387473254 |q (cloth) | ||
| 024 | 7 | |a 10.1007/978-0-387-47325-3 |2 doi | |
| 035 | |a (OCoLC)405547106 |z (OCoLC)316006466 |z (OCoLC)423033759 |z (OCoLC)428882818 |z (OCoLC)500973559 |z (OCoLC)646035636 |z (OCoLC)756712562 |z (OCoLC)781269646 |z (OCoLC)815754533 |z (OCoLC)858881518 |z (OCoLC)985060737 |z (OCoLC)1005766194 |z (OCoLC)1044280827 |z (OCoLC)1056373513 |z (OCoLC)1073060478 |z (OCoLC)1086921279 |z (OCoLC)1100910967 |z (OCoLC)1102280289 |z (OCoLC)1110807164 |z (OCoLC)1112538888 |z (OCoLC)1162775308 |z (OCoLC)1203985117 |z (OCoLC)1204092371 |z (OCoLC)1391799895 | ||
| 037 | |a 978-0-387-47325-3 |b Springer |n http://www.springerlink.com | ||
| 040 | |a GW5XE |b eng |e pn |c GW5XE |d IDEBK |d OCLCQ |d CDX |d N$T |d EBLCP |d UAB |d E7B |d OCLCQ |d OCLCF |d BEDGE |d OCLCQ |d COO |d YDXCP |d DEBSZ |d NUI |d AU@ |d VT2 |d OCLCQ |d ESU |d OCLCQ |d NJR |d OCLCQ |d CEF |d U3W |d WYU |d LHU |d YOU |d OCLCQ |d CNTRU |d W2U |d AUD |d OCLCQ |d DCT |d ERF |d OCLCQ |d OCLCO |d OCLCQ |d DKU |d OCLCO |d OCLCL | ||
| 049 | |a COM6 | ||
| 050 | 4 | |a TK7870.15 |b .N36 2008 | |
| 072 | 7 | |a TEC |x 008070 |2 bisacsh | |
| 072 | 7 | |a TEC |x 008060 |2 bisacsh | |
| 072 | 7 | |a TBN. |2 bicssc | |
| 082 | 0 | 4 | |a 621.381046 |2 22 |
| 245 | 0 | 0 | |a Nanopackaging : |b nanotechnologies and electronics packaging / |c edited by James E. Morris. |
| 260 | |a New York : |b Springer, |c ©2008. | ||
| 264 | 1 | |a New York : |b Springer, |c [2008] | |
| 264 | 4 | |c ©2008. | |
| 300 | |a 1 online resource (xxi, 543 pages) : |b illustrations. | ||
| 336 | |a text |b txt |2 rdacontent. | ||
| 337 | |a computer |b c |2 rdamedia. | ||
| 338 | |a online resource |b cr |2 rdacarrier. | ||
| 347 | |a text file. | ||
| 347 | |b PDF. | ||
| 504 | |a Includes bibliographical references and index. | ||
| 588 | 0 | |a Print version record. | |
| 505 | 0 | |a Nanopackaging: Nanotechnologies and Electronics Packaging -- Modelling Technologies and Applications -- Application of Molecular Dynamics Simulation in Electronic Packaging -- Advances in Delamination Modeling -- Nanoparticle Properties -- Nanoparticle Fabrication -- Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges -- Nanostructured Resistor Materials -- Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging -- Nanoconductive Adhesives -- Nanoparticles in Microvias -- Materials and Technology for Conductive Microstructures -- A Study of Nanoparticles in SnAg-Based Lead-Free Solders -- Nano-Underfills for Fine-Pitch Electronics -- Carbon Nanotubes: Synthesis and Characterization -- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications -- Carbon Nanotubes for Thermal Management of Microsystems -- Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes -- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes -- Nanowires in Electronics Packaging -- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging -- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities -- Nanoelectronics Landscape: Application, Technology, and Economy -- Errata. | |
| 520 | |a Nanopackaging: Nanotechnologies and Electronics Packaging presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, nanowire applications in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive "inks," underfill fillers, and solder enhancement. Nanopackaging: Nanotechnologies and Electronics Packaging is an important reference for Industrial and academic researchers as well as practicing engineers seeking information about the latest techniques, including: The importance of computer modeling in nanopackaging and offers suggestions for implementation Carbon Nanotubes and Nanoparticles, and their role in packaging, including basic properties and fabrication, and applications in solder, thermal management, and EMI control A comprehensive overview of nanoscale electronics and systems packaging Nanopackaging: Nanotechnologies and Electronics Packaging is an ideal reference for researchers, practicing engineers as well as graduate students who are either entering the field of for the first time, or those already conducting research and want to expand their knowledge in the field of nanopackaging. | ||
| 506 | |a University staff and students only. Requires University Computer Account login off-campus. | ||
| 650 | 0 | |a Electronic packaging. | |
| 650 | 0 | |a Nanotechnology. | |
| 650 | 0 | |a Chemistry. | |
| 650 | 0 | |a Electronics. | |
| 650 | 6 | |a Mise sous boîtier (Électronique) | |
| 650 | 6 | |a Nanotechnologie. | |
| 650 | 6 | |a Chimie. | |
| 650 | 6 | |a Électronique. | |
| 650 | 7 | |a chemistry. |2 aat. | |
| 650 | 7 | |a electronic engineering. |2 aat. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Microelectronics. |2 bisacsh. | |
| 650 | 7 | |a TECHNOLOGY & ENGINEERING |x Electronics |x Digital. |2 bisacsh. | |
| 650 | 7 | |a Science des matériaux. |2 eclas. | |
| 650 | 7 | |a Chimie. |2 eclas. | |
| 650 | 7 | |a Electronic packaging. |2 fast. | |
| 650 | 7 | |a Nanotechnology. |2 fast. | |
| 700 | 1 | |a Morris, James E., |d 1944- |1 https://id.oclc.org/worldcat/entity/E39PCjDB8XCVJw6v7j6dVMRTh3. | |
| 710 | 2 | |a SpringerLink (Online service) | |
| 776 | 0 | 8 | |i Print version: |t Nanopackaging. |d New York : Springer, ©2008 |z 9780387473253 |z 0387473254 |w (DLC) 2007932733 |w (OCoLC)154711827. |
| 907 | |a .b29522213 |b multi |c - |d 100215 |e 240320 | ||
| 998 | |a (3)cue |a cu |b 240227 |c m |d z |e - |f eng |g nyu |h 0 |i 2 | ||
| 948 | |a MARCIVE Overnight, in 2024.03 | ||
| 948 | |a MARCIVE Comp, in 2022.12 | ||
| 948 | |a MARCIVE Over, 07/2021 | ||
| 948 | |a MARCIVE Comp, 2018.05 | ||
| 948 | |a MARCIVE August, 2017 | ||
| 948 | |a MARCIVE extract Aug 5, 2017 | ||
| 994 | |a 92 |b COM | ||
| 995 | |a Loaded with m2btab.ltiac in 2024.03 | ||
| 995 | |a Loaded with m2btab.elec in 2024.02 | ||
| 995 | |a Loaded with m2btab.ltiac in 2022.12 | ||
| 995 | |a Loaded with m2btab.ltiac in 2021.07 | ||
| 995 | |a Loaded with m2btab.elec in 2021.06 | ||
| 995 | |a Loaded with m2btab.ltiac in 2018.06 | ||
| 995 | |a Loaded with m2btab.ltiac in 2017.08 | ||
| 995 | |a Loaded with m2btab.elec in 2016 | ||
| 995 | |a Loaded with m2btab.elec in 2016 | ||
| 995 | |a OCLC offline update by CMU | ||
| 999 | |e z | ||
| 999 | |a cue | ||
| 989 | |d cueme |e - - |f - - |g - |h 0 |i 0 |j 200 |k 240227 |l $0.00 |m |n - - |o - |p 0 |q 0 |t 0 |x 0 |w SpringerLink |1 .i150226275 |u http://ezproxy.coloradomesa.edu/login?url=https://link.springer.com/10.1007/978-0-387-47325-3 |3 SpringerLink |z Click here for access | ||