Guidelines for preparing applications
| Other Authors: | Technology Opportunities Program (U.S.), Telecommunications and Information Infrastructure Assistance Program (U.S.) |
|---|---|
| Format: | Microfilm |
| Language: | English |
| Published: |
Washington, D.C. :
U.S. Dept. of Commerce, National Telecommunications and Information Administration.
|
| Physical Description: |
volumes : forms ; 28 cm. Current issue only also available via the Internet from the NTIA web site. Address as of: 12/13/00: http://www.ntia.doc.gov/otiahome/top/grants/applicationkit.htm; current access is available via PURL. |
| Subjects: | |
| Online Access: |
https://purl.fdlp.gov/GPO/LPS7251 |
https://purl.fdlp.gov/GPO/LPS7251
CMU Storage Gov Pub Microfiche
Electronic Resource Click Here| Location | Call Number: | Status |
|---|---|---|
| CMU Storage Gov Pub Microfiche | C 60.8: T 23/2 | Available Place a Hold |